Achemetal Tungsten & Molybdenum Co., Ltd.
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Advanced Microelectronic Materials of molybdenum copper Mo-Cu electronic heat sink package
Product description
With constant improvement of functional efficiency of electronic elements and constant decrease of their volumes, thermal management of electronic systems has encountered severe challenges. Insufficient heat dissipation will cause bad influences on the efficiency and reliability of semiconductors. More than a half of electronic elements going wrong are caused by excessive heat. Electronic elements mounted on substrates can dissipate heat effectively only by a heat sink effect, thus stabilizing the operating temperature.
Tungsten-molybdenum and alloy materials have the following features:
Thermal expansion coefficients matched with those of sapphire substrates, silicon slices, gallium arsenide, ceramics and other materials;
Therefore, tungsten-molybdenum materials including pure molybdenum, molybdenum-copper, tungsten-copper and copper-molybdenum-copper (CMC) used for heat sink are used in LED packaging and electronic packaging in large quantity.
Molybdenum copper
Specifications
| Materials | wt% | Density | CTE | Thermal Conductivity | |
| Cu | Mo | g/cm3 | 10-6/K | W/M·K | |
| Mo90Cu10 | 10±1 | Balance | 10 | 5.6 | 150-160 |
| Mo85Cu15 | 15±1 | Balance | 9.93 | 6.8 | 160-180 |
| Mo80Cu20 | 20±1 | Balance | 9.9 | 7.7 | 170-190 |
| Mo70Cu30 | 30±1 | Balance | 9.8 | 8.1 | 180-200 |
| Mo60Cu40 | 40±1 | Balance | 9.66 | 10.3 | 210-250 |
| Mo50Cu50 | 50±1 | Balance | 9.54 | 11.5 | 230-270 |
| Mo40Cu60 | 40 ±0.2 | Balance | 9.42 | 11.8 | 280 – 290 |
As a pseudo-alloy, Mo-Cu alloy is composed of molybdenum and copper that not melt in solid solution, and integrated each others. It is characterized by high thermal conductivity, low and adjustable coefficient of thermal expansion, non-magnetic, low gas content, good vacuum performance, good machining ability and outstanding properties in high temperature. It is widely used in machinery, electric power, electronics, electric vehicle,metallurgy and other industries
Product detail
Specification: Bared and coated with Nickle, gold.
Tungsten copper
Specifications
| Typical W-Cu Alloy Properties | |||||
| Materials | wt% | Density | CTE | Thermal Conductivity | |
| Cu | W | 10-6/K | g/cm3 | W/M·K | |
| W94Cu6 | 6±1 | Balance | 17.6 | 6 | 140-160 |
| W90Cu10 | 10±1 | Balance | 17 | 6.5 | 180-190 |
| W85Cu15 | 15±1 | Balance | 16.4 | 7 | 190-200 |
| W80Cu20 | 20±1 | Balance | 15.6 | 8.3 | 200-210 |
| W75Cu25 | 30±1 | Balance | 14.8 | 9 | 220-230 |
| W50Cu50 | 50±1 | Balance | 12 | 12.5 | 310-340 |
Features
With the 6~50% copper(by weight), the W-Cu alloy has integrated both advantages of tungsten and copper. Characterized by good high temperature resistance, arc ablation resistance, thermal and electrical conductivity , high strength, machining-ease, and outstanding sweat cooling ability and specific gravity ,it is widely applied in machinery, electric power, electronics, metallurgy, aerospace and other industries.
Product detail
Specification: bared, coated with nickel and gold
Advantage:
CMCC(Cu/MoCu/Cu) and CMC(Cu/Mo/Cu) is a 3-layer-structure material. The chip is MoCu or Mo, coated with Cu. Thanks to the lower heat expansion coefficient and far better heat conductivity than WCu and MoCu, the high power electronic components to provide better alternative and help cooling high-power IGBT modules and other components
Specification:
We can provide all kinds of products with different thickness and layers to meet customers various requirements.
Typical properties table of heat sink products
| Product | Components[wt%] | Density[g/cm3] | Coefficient of Heat expansion[10-6/K] | Heat conductivity[W/(m·K)] |
| CMCC141 | Cu/MoCu30/Cu 1:4:1 | 9.5±0.2 | 7.3/10.0/8.5 | 220 |
| CMCC232 | Cu/MoCu30/Cu 2:3:2 | 9.3±0.2 | 7.5/11.0/9.0 | 255 |
| CMCC111 | Cu/MoCu30/Cu 1:1:1 | 9.2±0.2 | 9.5 | 260 |
| CMCC212 | Cu/MoCu30/Cu 2:1:2 | 9.1±0.2 | 11.5 | 300 |
| CMC111 | Cu/Mo/Cu 1:1:1 | 9.3±0.2 | 8.3 6.4(20~800℃) | 305(surface) 250(thickness) |
| S-CMC51515 | Cu/Mo/Cu/Mo/Cu 5:1:5:1:5 | 9.2±0.2 | 12.8 6.1(20~800℃) | 350(surface) 295(thickness) |
| No-Oxgen Cu TU1 | Cu | 8.93 | 17.7 | 391 |