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CuMoCu Materials For Electronics Packaging CuMoCu heat sink from Luoyang factory
It is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.
Specification
Type | Composition | Properties | ||||
element |
Content wt% | Density |
CTE ppm/K |
TC, W/m•K
| ||
Mass density, g/cm3 | Relative density, %T.D | |||||
Mo70Cu30 | Mo Cu | 70±1 balance
| 9.7 | ≥99 | 7.6~8.5 | 190~200 |
Mo60Cu40 | Mo Cu | 60±1 balance
| 9.6 | ≥99 | 9.2~9.4 | 200~220 |
Mo50Cu50 | Mo Cu | 50±1 balance
| 9.5 | ≥99 | 10.2~10.5 | 220~250 |
Production Process
Application
Heat sinks for RF/MW packages
Heatsinks for IC modules
Packing & Delivery